intersil的J3.A — 3焊盘带引脚的陶瓷芯片载体封装（CLCC）

J3.A — 3 Pad Hermatic SMD.5 Package Ceramic Bottom Terminal Chip Carrier
Hermetic Packages for Integrated Circuits

Ceramic Leadless Chip Carrier Packages (CLCC)
J3.A
3 PAD HERMATIC SMD.5 PACKAGE
CERAMIC BOTTOM TERMINAL CHIP CARRIER
D B
INCHES MILLIMETERS
SYMBOL MIN MAX MIN MAX NOTES
A 0.110 0.124 2.79 3.15 3