intersil的J20.A — Mil-Std-1835 CQCC1-N20 (C-2) 20焊盘带引脚的陶瓷芯片载体封装（CLCC）

J20.A — Mil-Std-1835 CQCC1-N20 (C-2) 20 Pad Ceramic Leadless Chip Carrier Package
Hermetic Packages for Integrated Circuits

Ceramic Leadless Chip Carrier Packages (CLCC)

0.010 S E H S
J20.A MIL-STD-1835 CQCC1-N20 (C-2)
20 PAD CERAMIC LEADLESS CHIP CARRIER PACKAGE
D
INCHES MILLIMETERS
D3
SYMBOL MIN MAX MIN MAX NOTES
j x 45o