资料介绍
W6X6.36 — 6x6 Array 36 Ball Wafer Level Chip Scale Package Plastic Packages for Integrated Circuits
Wafer Level Chip Scale Package (WLCSP) W6x6.36
E 6x6 ARRAY 36 BALL WAFER LEVEL CHIP SCALE PACKAGE
SYMBOL MILLIMETERS
A 0.44 Min, 0.495 Nom, 0.55 Max
A1 0.190 ±0.030
A2 0.305 ±0.025
PIN 1 ID
D b 0.27