intersil的W5X5.25B — 5x5阵列25球晶圆级芯片规模封装(WLCSP)

W5X5.25B — 5x5 Array 25 Ball With 0.40 Pitch Wafer Level Chip Scale Package (WLCSP)
Plastic Packages for Integrated Circuits

Package Outline Drawing
W5x5.25B
5X5 ARRAY 25 BALL WITH 0.40 PITCH WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
Rev 2, 12/11


X 1.60
Y 2.11±0.03
25x 0.225±0.03

E


D
0.40
2.13±0.03 C