intersil的W4X6.24 — 4x6阵列24球晶圆级芯片规模封装(WLCSP)

W4X6.24 — 4x6 Array 24 Ball Wafer Level Chip Scale Package (WLCSP)
Plastic Packages for Integrated Circuits

Package Outline Drawing
W4x6.24
4X6 ARRAY 24 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
Rev 1, 9/10

1.60± 0.02
1.20 24X 0.270 ± 0.03
PIN A1


F


E


D
2.40± 0.02