intersil的W4X5.20 — 4x5阵列20球晶圆级芯片规模封装(WLCSP)

W4X5.20 — 4x5 Array 20 Ball Wafer Level Chip Scale Package (WLCSP)
Plastic Packages for Integrated Circuits

Package Outline Drawing
W4x5.20
4x5 Array 20 Ball Wafer Level Chip Scale Package (WLCSP)
Rev 1 8/09


2.545 ± 0.02 X
2.00
Y 20X 0.32 ± 0.03

4
0.25