intersil的W4X4.16 — 4x4阵列16球晶圆级芯片规模封装(WLCSP)

W4X4.16 — 4x4 Array 16 Ball Wafer Level Chip Scale Package (WLCSP)
Plastic Packages for Integrated Circuits

Package Outline Drawing
W4x4.16
4X4 ARRAY 16 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP)
Rev 0, 6/10
1.965±0.02 X
Y 1.20 16X 0.270 ± 0.025

LOGO ID
4


3