资料介绍
W3X4.12 — 3x4 Array 12 Ball Wafer Level Chip Scale Package (WLCSP) Plastic Packages for Integrated Circuits
Wafer Level Chip Scale Package (WLCSP 0.4mm Ball Pitch)
W3x4.12
D 3x4 ARRAY 12 BALL WAFER LEVEL CHIP SCALE PACKAGE
SYMBOL MILLIMETERS
A 0.445 Min 0.495 Nom 0.545 Max
E A1 0.190 ±0.025
A2 0.305 ±0.025