intersil的W3X3.9C — 3x3 阵列9球晶圆级芯片规模封装(WLCSP)

W3X3.9C — 3x3 Array 9 Ball Wafer Level Chip Scale Package
Plastic Packages for Integrated Circuits

Wafer Level Chip Scale Package W3x3.9C
(WLCSP 0.4mm Ball Pitch) 3x3 ARRAY 9 BALL WAFER LEVEL CHIP SCALE PACKAGE
SYMBOL MILLIMETERS
E A 0.445 Min, 0.495 Nom, 0.545 Max
A1 0.190 ±0.025
A2 0.305 ±0.025
D b 0.270 ±0.03