资料介绍
W3X3.9B — 3x3 Array 9 Ball Wafer Level Chip Scale Package (Intersil Standard) Plastic Packages for Integrated Circuits
Wafer Level Chip Scale Package (WLCSP) W3x3.9B
3x3 ARRAY 9 BALL WAFER LEVEL CHIP SCALE PACKAGE
E (Intersil Standard)
SYMBOL MILLIMETERS NOTES
A 0.54 Min, 0.65 Max -
PIN A1 ID AREA
D A1 0.24 ±0.03 -