intersil的W3X3.9A — 3x3 阵列9球晶圆级芯片规模封装(只用于ISL59116, ISL59117 )

W3X3.9A — 3x3 Array 9 Ball Wafer Level Chip Scale Package (For ISL59116, ISL59117 Only)
Plastic Packages for Integrated Circuits

Wafer Level Chip Scale Package (WLCSP) W3x3.9A
3x3 ARRAY 9 BALL WAFER LEVEL CHIP SCALE PACKAGE
E (For ISL59116, ISL59117 Only)
SYMBOL MILLIMETERS NOTES
A 0.62 +0.05 -0.08 -
PIN A1 ID AREA
D A1 0.24 ±0.025 -