资料介绍
W3X2.6C — 3x2 Array 6 Ball Wafer Level CSP (for ISL28138C, ISL28136C, EL8176, EL8178) Plastic Packages for Integrated Circuits
Wafer Level Chip Scale Package (WLCSP) W3x2.6C
3x2 ARRAY 6 BALL WAFER LEVEL CHIP SCALE PACKAGE
E SYMBOL MILLIMETERS
A 0.51 Min, 0.55 Max
A1 0.225 ±0.015
D
A2 0.305 ±0.013