intersil的M8.173 — 8铅细收缩轮廓封装（TSSOP）

M8.173 — 8 Lead Thin Shrink Small Outline Package
Plastic Packages for Integrated Circuits

Package Outline Drawing
M8.173
8 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 2, 01/10
A
2 4
3.0 ±0.5

8 5 SEE DETAIL "X"




6.40

4.40 ±0.10 C
L
3 4



PIN 1
ID MARK
0.20 C BA 1 4


0.65 B