intersil的M38.173B — 38铅细收缩轮廓封装（TSSOP）

M38.173B — 38 Lead Thin Shrink Small Outline Exposed Pad Plastic Package
Plastic Packages for Integrated Circuits

Thin Shrink Small Outline Exposed Pad Plastic Packages (EPTSSOP)

N
M38.173B
INDEX 0.25(0.010) M B M
AREA E 38 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
E1
GAUGE INCHES MILLIMETERS
-B- PLANE
SYMBOL MIN