intersil的M28.173 — 28铅细收缩轮廓封装（TSSOP）

M28.173 — 28 Lead Thin Shrink Small Outline Plastic Package
Plastic Packages for Integrated Circuits

Package Outline Drawing
M28.173
28 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 1, 5/10
A

1 3
9.70± 0.10
SEE DETAIL "X"
28 15




6.40
PIN #1
4.40 ± 0.10 I.D. MARK
2 3