资料介绍
M24.173C — 24 Lead Heat-sink Thin Shrink Small Outline Package (HTSSOP) Plastic Packages for Integrated Circuits
Package Outline Drawing
M24.173C
24 LEAD HEAT-SINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)
Rev 1, 12/09
A
1 3
7.80 ±0.10 4.30 ±0.10
24 13 SEE
DETAIL "X"
6.40
PIN #1 3.00 ±0.10