intersil的M24.173 — 24铅细收缩轮廓封装（TSSOP）

M24.173 — 24 Lead Thin Shrink Small Outline Plastic Package
Plastic Packages for Integrated Circuits

Package Outline Drawing
M24.173
24 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 1, 5/10

A
1 3
7.80 ±0.10

24 13 SEE DETAIL "X"




6.40
PIN #1
4.40 ±0.10 I.D. MARK
2 3




0.20 C B A 1