intersil的M20.173 — 20铅细收缩轮廓封装（TSSOP）

M20.173 — 20 Lead Thin Shrink Small Outline Plastic Package
Plastic Packages for Integrated Circuits

Package Outline Drawing
M20.173
20 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)
Rev 2, 5/10
A
1 3
6.50 ±0.10

20 10 SEE DETAIL "X"




6.40
PIN #1
I.D. MARK
4.40 ±0.10
2 3




0.20 C B A 1 9

0.65 B