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【应用笔记】FPGA的发热管理(Thermal Management for FPGAs)

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【应用笔记】FPGA的发热管理(Thermal Management for FPGAs)
本应用笔记提供对Altera器件的发热管理向导,帮组你决定你应用中的热性能。
This application note provides guidance on thermal management of Altera® devices
and helps you determine the thermal performance for your application. The factors
you must consider in evaluating heat dissipation include evaluating the
characteristics of the PCB used, determining the use for a heat sink, and selecting the
type of thermal interface material (TIM).
Thermal Management for FPGAs
Thermal Management for FPGAs



AN-358-4.0 Application Note




This application note provides guidance on thermal management of Altera devices
and helps you determine the thermal performance for your application. The factors
you must consider in evaluating heat dissipation include evaluating the
characteristics of the PCB used, determining the use for a heat sink, and selecting the
type of thermal in……
标签:AlterahermalmanagementheatheatdissipationthermalresistancethermalinterfacematerialTIMheatsinkheatsinkcalculationattachmentmethodtippingtiltinglidlesspackagedevicepackage
【应用笔记】FPGA的发热管理(Thermal Management for FPGAs)
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