首页|嵌入式系统|显示技术|模拟IC/电源|元件与制造|其他IC/制程|消费类电子|无线/通信|汽车电子|工业控制|医疗电子|测试测量
首页 > 分享下载 > 嵌入式系统 > 【应用笔记】高速通道设计的过孔优化技巧(Via Optimization Techniques for High-Speed Channel Designs)

【应用笔记】高速通道设计的过孔优化技巧(Via Optimization Techniques for High-Speed Channel Designs)

资料介绍
【应用笔记】高速通道设计的过孔优化技巧(Via Optimization Techniques for High-Speed Channel Designs)
本应用介绍高速通道设计的过孔优化技巧。
As more designs move toward high-speed serial links with picosecond
edge rates, any impedance discontinuity in the channel can adversely
affect signal quality. Channel discontinuities come from several sources
and each source must be carefully considered. One commonly
overlooked source of channel discontinuity is the signal via. Vias can add
jitter and reduce eye openings that can cause data misinterpretation by
the receiver.
Via Optimization Techniques
for High-Speed Channel
Designs
May 2008, version 1.0 Application Note 529



Introduction As more designs move toward high-speed serial links with picosecond
edge rates, any impedance discontinuity in the channel can adversely
affect signal quality. Channel discontinuities come from several sources
and each source must be carefully considered. One commonly
overlooked source of channel discontinuity is the signal via. Vias can ad
标签:Alteraviaoptimizationtechniqueshighspeedchanneldesignshigh-speedlumpedpidifferentialmodelcascadedbackdrillingbackdrill
【应用笔记】高速通道设计的过孔优化技巧(Via Optimization Techniques for High-Speed Channel Designs)
本地下载

评论