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首页 > 分享下载 > 嵌入式系统 > 【应用笔记】为高速通道设计优化由表面贴装焊盘引起的阻抗不连续(Optimizing Impedance Discontinuity Caused by Surface Mount Pads for High-Speed Channel Designs)

【应用笔记】为高速通道设计优化由表面贴装焊盘引起的阻抗不连续(Optimizing Impedance Discontinuity Caused by Surface Mount Pads for High-Speed Channel Designs)

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【应用笔记】为高速通道设计优化由表面贴装焊盘引起的阻抗不连续(Optimizing Impedance Discontinuity Caused by Surface Mount Pads for High-Speed Channel Designs)
由于数据传输速率不断增加,如今的高速板设计师对升级他们的设计来满足不断增张的带宽需求,面临巨大挑战。
As data rates continue to increase, today’s high-speed board designers
face tremendous challenges upgrading their designs to meet increasing
bandwidth requirements. When implementing high-speed designs, any
small discontinuities in the physical geometries along the transmission
path can significantly degrade the signal. This degradation includes loss
of signal amplitude, reduction of signal rise time, and increased jitter. As
a result, you must be able to identify these discontinuities in the
high-speed channel and provide ways to mitigate their effects for better
signal transmission.
Optimizing Impedance Discontinuity
Caused by Surface Mount Pads for
High-Speed Channel Designs

May 2008, version 1.0 Application Note 530



Introduction As data rates continue to increase, today’s high-speed board designers
face tremendous challenges upgrading their designs to meet increasing
bandwidth requirements. When implementing high-speed designs, any
small discontinuities in the physical geometries along the transmission
path can significantly degrade the signal. This degradation includes……
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【应用笔记】为高速通道设计优化由表面贴装焊盘引起的阻抗不连续(Optimizing Impedance Discontinuity Caused by Surface Mount Pads for High-Speed Channel Designs)
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