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首页 > 分享下载 > 元件与制造 > 【应用笔记】无引线倒装芯片球栅阵列的热处理和机械处理(Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array)

【应用笔记】无引线倒装芯片球栅阵列的热处理和机械处理(Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array)

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【应用笔记】无引线倒装芯片球栅阵列的热处理和机械处理(Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array)
本应用笔记对Altera的器件的无引线倒装芯片球栅阵列(flip chip ball-grid array,FCBGA)的热处理和机械处理提供指导。
This application note provides guidance on thermal management and mechanical
handling of lidless flip chip ball-grid array (FCBGA) for Altera® devices.
Thermal Management and Mechanical
Handling for Lidless Flip Chip Ball-Grid
Array
AN-659-1.0 Application Note




This application note provides guidance on thermal management and mechanical
handling of lidless flip chip ball-grid array (FCBGA) for Altera devices.
This application note includes the following sections:
……
标签:AlterareliabilitytestthermaladhesiveheatsinkattachmentthermalinterfacecompressioncoplanarityFCBGAflipchipball-gridarray
【应用笔记】无引线倒装芯片球栅阵列的热处理和机械处理(Thermal Management and Mechanical Handling for Lidless Flip Chip Ball-Grid Array)
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