首页|嵌入式系统|显示技术|模拟IC/电源|元件与制造|其他IC/制程|消费类电子|无线/通信|汽车电子|工业控制|医疗电子|测试测量
首页 > 分享下载 > 嵌入式系统 > 倒装片封装基板焊接问题

倒装片封装基板焊接问题

资料介绍
倒装片封装基板焊接问题
White Paper: Virtex-II and Virtex-II Pro Families

R




WP208 (v1.1) January 14, 2004



Flip-Chip Package Substrate
Solder Issue
By: Abhay Maheshwari and Austin Lesea




Alpha particle emission in close proximity to the
device circuitry is minimized by following Xilinx
low alpha solder requirements on package substrate
pads. One flip-chip packaging vendor’s failure to
co
标签:Xilinxfpga
倒装片封装基板焊接问题
本地下载

评论