【应用手册】PCB Stackup Design Considerations for Altera FPGAs

【应用手册】PCB Stackup Design Considerations for Altera FPGAs
This application note presents an overview of the PCB stackup construction and material
selection criteria. It discusses the important material parameters that influence the electrical
performance and manufacturability of the design, as well as layer usage and the importance
of layer organization within the stackup for arriving at a well-designed PCB. Cost
consideration is also discussed where applicable. Finally, specific recommendations and
requirements for Altera® FPGAs, including the Stratix®, Arria®, and Cyclone® device
families, are listed in the appendix.
The PCB stackup design plays a central part in the overall system performance, especially
with high-performance FPGAs that incorporate transceiver technology. The PCB stackup is
the substrate upon which all design components are assembled. A poorly designed PCB
stackup with inappropriately selected materials can degrade the electrical performance of
signal transmission, power delivery, manufacturability, and long term reliability of the
finished product. To successfully design PCB stackups for FPGA designs, you must have a
good understanding of both PCB construction and the factors that influence material
selection and cost.
PCB Stackup Design Considerations for
Altera FPGAs

AN-613-1.0 Application Note




This application note presents an overview of the PCB stackup construction and material
selection criteria. It discusses the important material parameters that influence the electrical
performance and manufacturability of the design, as well as layer usage and the importance
of layer organization within the stackup for arriving at a wel