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【应用手册】Thermal Management and Mechanical Handling for Altera FCmBGA Devices

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【应用手册】Thermal Management and Mechanical Handling for Altera FCmBGA Devices
This application note describes the thermal composite flip chip molded ball-grid array
(FCmBGA) package for the Arria V device family.
FCmBGA improves board real-estate use by allowing closer spacing between passive
components and the flip chip die, providing better warpage control for thin core
substrates, and improving solder joint reliability.
Thermal Management and Mechanical
Handling for Altera FCmBGA Devices

AN-657-1.0 Application Note




This application note describes the thermal composite flip chip molded ball-grid array
(FCmBGA) package for the Arria V device family.
FCmBGA improves board real-estate use by allowing closer spacing between passive
components and the flip chip die, providing better warpage control for thin core
标签:AlteraFPGAArriaVFCmBGA
【应用手册】Thermal Management and Mechanical Handling for Altera FCmBGA Devices
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