资料介绍
All semiconductor devices are sensitive to electrostatic
discharge (ESD) damage to varying degrees. This is
true whether they are soldered to a PC board in an
application, or whether they are unattached in the ship-
ping or application assembly process. Good handling
techniques such as groundstraps, static free work
stations and ionizers can reduce the risk of static build
up during assembly. Often more attention is paid to
reducing ESD during assembly than is paid to reducing
ESD risk during the lifetime of the application. AN595
Improving the Susceptibility of an Application
to ESD-Induced Latch-up
This short circuit will tend to reduce the voltage level on
Author: David Wilkie the application (particularly if the application is battery
Microchip Technology Inc. powered) and will do a great deal of damage to the
device which has latched-up. The only way to halt this
condition is to remove power from the device.
All semi
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