资料介绍
For many years, the 8-lead SOIC package has been
the most popular package for serial EEPROMs, but
now smaller packages are becoming more and more
commonplace. This offers a number of benefits; the
reductions in footprint size and component height are
some of the more obvious ones. Smaller packages also
generally offer a cost advantage over their larger
counterparts.
Currently, the SOT-23 package is one of the smallest
packages available for serial EEPROMs, and its popu-
larity has been growing significantly. However, while
the SOIC is an industry-standard package available
from all major EEPROM vendors, the SOT-23 package
is still relatively new, especially in larger memory den-
sities. When a new, smaller package is first released by
a vendor, there is always an inherent lag before the
package becomes available from all vendors. For
example, Microchip was the first vendor to offer 32- and
64-Kbit I
2
C™ serial EEPROMs in a 5-lead SOT-23
package and it will take time before other vendors offer
similar devices.
System designers can use the SOT-23 package and
enjoy the associated benefits, or they can maintain a
broad list of possible vendors. Now, by combining
footprints, both can be done at the same time. AN1420
Adding Flexibility by Using Multiple
Footprints for Microwire Serial EEPROMs
This idea can also be applied to other 8-lead packages,
Author: Chris Parris such as the TSSOP and MSOP, if the application
Microchip Technology Inc. allows for a small amount of extra board space to be
used.
INTRODUCTION FIGURE 1: COMBINED 6-LEAD SOT-23
For many years, the 8-lead SOIC package has been
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