多层PCB上小信号分立器件的热行为

本应用笔记说明使用多层PCB如何改善分立元件的功耗。它侧重于讲解使用较大的覆铜来提高应用的热性能的影响。
AN11076
Thermal behavior of small-signal discretes
on multilayer PCBs
Rev. 1 ― 11 July 2011 Application note




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Keywords Low VCEsat, BISS, thermal resistance (Rth), thermal impedance (Zth),
total power dissipation (Ptot)
Abstract This application note illustrates how to improve the power dissipation of
discrete components by using multilayer PCBs. It focuses on the impact of
using larger copper areas to improve the thermal behavior of applications.
NXP Semiconductors AN11076