有关Shell-Op的3D封装的pcb的装配指导

有关Shell-Op的3D封装的pcb的装配指导
PCB Assembly Guidelines for
Shell-Op 3D Package
Technical Brief March 15, 2011 TB478.1



Introduction The Shell-Op 3D package has been qualified to meet
JEDEC MSL3 requirements. The units must be mounted on
The Shell-Op 3D package is a cavity package that utilizes a
a b