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有关预防 Boot-to-Phase Stress on Half-Bridge MOSFET Driver ICs的指导

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有关预防 Boot-to-Phase Stress on Half-Bridge MOSFET Driver ICs的指导

Surface Mount Assembly Guidelines for Optical
Dual Flat Pack No Lead (ODFN) Package
Technical Brief March 16, 2009 TB477.2



Introduction This package follows conventional DFN/QFN guidelines for
PCB land pattern design and surface mount processing.
Optical Dual-in-line Flat No-lead (ODFN) packages are
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有关预防 Boot-to-Phase Stress on Half-Bridge MOSFET Driver ICs的指导
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