PCB的Land Pattern设计和QFN封装的表贴器件的指导

PCB的Land Pattern设计和QFN封装的表贴器件的指导

PCB Land Pattern Design and Surface Mount
Guidelines for QFN Packages
Technical Brief April 23, 2009 TB389.6
Authors: Mark Kwoka and Jim Benson


Introduction QFN Package Outline Drawings
Intersil's Quad Flat No Lead (QFN) package family offering Intersil’s individual product data sheets reference to the
is a relatively new packaging concept