Package Thermal Resistance Values (Theta JA, Theta JC) for Temperature Sensors and 1-Wire Devices

Abstract: Two common thermal-resistance values measured for IC packages are junction to ambient (Theta JA) and junction to case (Theta JC). These parameters are useful for calculating maximum power dissipation and self-heating, and for comparing package types. Theta JA and Theta JC values are presented here for select Maxim temperature sensors and 1-Wire® devices. Examples for calculating the values are given.
Package Thermal Resistance Values (Theta JA, Theta JC) for Temperature
Sensors and 1-Wire Devices
Nov 16, 2006

Abstract: Two common thermal-resistance values measured for IC packages are junction to ambient (Theta JA) and junction to case (Theta JC). These parameters are useful for
calculating maximum power dissipation and self-heating, and for comparing package types. Theta JA and Theta JC values are presented here for select Maxim temperature
sensors and 1-Wire devices. Examples for calculating the values are given.


Introduction
Managing heat in electronic systems is crucial for ensuring product reliability. Integrated circuits (ICs) exposed to high temperatures can fail or malfunction in the field, thus
requiring costly repair or redesign. Typical thermal-resistance parameters give t