【技术应用笔记】引脚架构芯片级封装（LFCSP）设计与制造指南

【技术应用笔记】引脚架构芯片级封装（LFCSP）设计与制造指南
(LFCSP)
ǖGary Griffin



................................................................................................... 1 (LFCSP)
................................................................................................... 1 LFCSPJEDEC MO220MO229
...................................................................................... 2
........................................................................................... 5
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