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07.DC 到 45GHz 频带应用 GaAs 表面贴装芯片级封装 MMIC 产品

资料介绍
Packaging has always been the “Achilles Heal” of extract-ing the maximum microwave performance out of any IC technology. The inherent parasitic capacitance and in-ductance associated with bond wires, lead frames, and encapsulating dielectric materials dominate the fnal products high frequency performance. One way to solve this problem is to eliminate parasitic causing factors and make the IC become the package. This is the basis of WSP (Wafer Scale Packaging).
GaAs-Based Surface Mount Wafer Scale Package MMICs
for DC to 45 GHz Applications

White Paper
By: Henrik Morkner




I. Introduction
Packaging has always been the “Achilles Heal” of extract- Avago Technologies has been experimenting with WSP for
ing the maximum microwave performance out of any IC over 10 years. It was originally developed to provide a low
technology. The inherent parasitic capacitance and in- cost hermetic package for FBAR MEMs silicon technology.
ductance associated with bond wires, lead frames, and Leveraging off silicon wafer bonding technology, the WSP
encapsulating dielectric materials dominate the final solution was applied to GaAs PHEMT IC fab……
标签:AvagoMMIC
07.DC 到 45GHz 频带应用 GaAs 表面贴装芯片级封装 MMIC 产品
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