资料介绍
Smaller, lower cost components are crucial to the devel-opment of today’s higher-performance, smaller and in-creasingly price-competitive mobile devices. Since the
introduction of chip scale packages (CSPs) they have be-come a major trend in active device packaging. Chip scale packaging combines the size and performance advantage of bare die assembly and the reliability of encapsulated devices, while permitting automated assembly processes and low production costs. Avago introduces 18 GHz and 26.5 GHz low-noise
E-pHEMT in 0402 Compatible Packages Produced
by Advanced Wafer-scale Packaging Technology
White Paper
Introduction
Smaller, lower cost components are crucial to the devel- Wafer-scale packaging (WSP), also known as wafer-level
opment of today’s higher-performance, smaller and in- packaging (WLP) or wafer-level chip scale packaging
creasingly price-competitive mobile devices. Since the (WLCSP), essentially consists of extending the wafer fabri-
introduction of chip scale packages (CSPs) they have be- cation processes to include packaging. This contrasts with
come a major trend in active device packaging. Chip scale the common approach of dicing a wafer into individual
packaging combines the si
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