16.EEPROMs in miniature packages

MLP 2x3, WLCSP
EEPROMs in miniature packages
MLP 2x3, WLCSP



Innovative solutions for EEPROMs

As well as EEPROM flexibility and low-power functioning, ST
offers kilobytes of EEPROM packaged in a few millimeters
with wafer level CSP or MLP 2x3 to allow you to save space
and cost.
The smallest packaging solutions for memory provide high