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IC元件的封装技术基础知识_Virginia Tech

资料介绍
来自Virginia Tech的IC器件封装的基本知识
Fundamentals of IC Assembly

! What is IC Assembly?
! Purpose of IC Assembly
! Requirements of IC Assembly
! IC Assembly Technologies
! Wirebonding
! Tape Automated Bonding
! Flip Chip
! Summary and Future Trends




Virginia Tech C09 - 1
Objectives

! To define and describe the purpose of IC
assembly
! Describe the three primary IC assembly
technologies
! Project future needs




Virginia Tech C09 - 2
What is IC Assembly?

! IC assembly is the first step after wafer fab
that enables the die to be packaged
! IC assembly is defined as the process of
electrically connecting I/O bond pads on the
IC to the corresponding bond pads on the
package
! Ther……
IC元件的封装技术基础知识_Virginia Tech
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评论

jp2510贾鹏· 2010-01-22 22:48:18
不错