Lecture_semiconductor packaging

lecture for semiconductor packaging method. to understand package material, process, design ect.
Semiconductor Packaging
Number of Lectures: 2

Learning Objectives: To appreciate the need for a variety of semiconductor packages, and the
characteristics that influence the selection of package for an application.

At the end of the Module the student should be able to:

To understand the need for and the availability of a large variety of packages at the chip
level.

To understand the characteristics of single chip packages and their influence on the system
construction and performance

To appreciate the criteria according to which a chip level package is selected.

To have an appreciation of different interconnection technologies used in single chip
packages.

To have an overall appreciation of materials issues in chip level packaging

To become fami