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學手機PCB佈線

资料介绍
手機布線要求BB/RF/layout Training Session

Gary Hsu

Bientec

Typical PCB structure (1/3)
4 20 4 16 8 16 8

L1 L2
20 8 12 4 8 8 4 18

L3
12

Ln-2
24 5 12

Ln-1 Ln N>=8

24

18

12

Unit: mil
2

Bientec

Typical PCB structure (2/3)


Multi-Layer Structure
6 860um +/-10%

Number of layers: Total thickness (measured on solder resist):

Layer 1 copper thickness----------------------------------------------------0.7mil Epoxy 1 thickness (rcc)------------------------------------------------------2.0mil Layer 2 copper thickness----------------------------------------------------1.4mil Epoxy 2 thickness (Prepreg FR4)--------( 1080 x 2 ) ---------------5.5mil Layer 3 copper thickness----------------------------------------------------1.4mil Epoxy 3 thickness (Core FR4)----------------------------------------……
标签:手機布線要求
學手機PCB佈線
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