资料介绍
無鉛焊接的隱憂 BGA
1
2
1. 2. 3. SAC Climbing 4. Ni(0.07 by wt) ( T) mp 3 Mobility Fluidity (Spreading) Reflow SC 3 T 0.1 by wt
4
5
6
1 2 3 4 5 6 i
6
1
3
2
4
5
7
i
8
9
10
S/M
S/M on Pads
11
BGA
BGA 27 27mm 35 35mm 10 Substrate LF ” 4.1 4.2 Tg BT Packaging Assembly 7 8 S/M on Pad 4 “ FR-4
12
13
4.3
Die Attach
Wire Bond
Flux
4.4 CTE 4.5 LF
OSP
14
15
16
17
18
1 2 3 4 5
19
“ ” ―― “ ”
Weight %
20
―― “ “
” ”
”
――
“
21
22
“ ”
1 2
3 “
4 ” “
”
23
24
25
5 6 “ ” 1
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