首页|嵌入式系统|显示技术|模拟IC/电源|元件与制造|其他IC/制程|消费类电子|无线/通信|汽车电子|工业控制|医疗电子|测试测量
首页 > 分享下载 > 消费类电子 > PCB-Stack Design Papers

PCB-Stack Design Papers

资料介绍
PCB Stack-Up -- Part 2 - Four-Layer Boards
[pic]
PCB Stack-Up
Part 2. Four-Layer Boards
The most common four-layer board configuration is shown in Fig. 1 (power
and ground planes may be reversed). It consists of four uniformly spaced
layers with internal power and ground planes. The two external trace layers
usually have orthogonal trace routing directions.
                _____________ Sig.
                _____________ Ground                         Figure 1
                _____________ Power
                _____________  Sig.
 
Although this configuration is significantly better than a two-layer board,
it has a few, less that ideal characteristics.  With respect to the list of
objectives in Part 1, this stack-up only satisfies objective (1).  If the
layers are equally spaced, there is a large s
PCB-Stack Design Papers
本地下载

评论