资料介绍
PCB layout checklist
PCB layout checklist
Line-in L& R:
1) do not run parallel with digital data of flash
切勿與Flash的数據線並行
line-out L & R
1) Make sure the line-out signals to the headphone do not run in parallel
with any of the NAND flash signals.
切勿與Flash的数據線並行
2) do not run close to noisy components of EL backlight IC, Xtal and L4.
远离容易产嘈音的零件, 包括 EL, 晶振及 L4
Head phone components grounding
1) Use GND instead of AGND for the headphone components (R1,R2, R3, R4,
L4). It is better to use the solid GND plane than to stretch the AGND
trace so far from the chip.
耳机线路的R1, R2, R3, R4, L4连接GND, 不是AGND. 使用大片GND 比延伸
AGND线远离 CHIP 更有效
Microphone
1) Add ferrite bead between GND
使用磁珠连接GND
GND & AGND
1) The internal layer should be one large GND plane, with a small section
cut out to use as