COB-chip-on-board

COB-chip-on-boardCOB
Chip on board enabling fast product upgrades
Wire Bonding Die Preparation

Die Attach

Thermal Management

Encapsulation

Glob Top

WHAT IS CHIP ON BOARD (COB)?

C-MAC COB is a high-density MCM (Multi Chip Module) technology that integrates bare semiconductor chips directly on to the interconnect substrate. A manufacturing solution that allows fast modification of existing product designs, even where space is at a premium. C-MAC’s COB design and manufacturing methodology allows additional functionality to be introduced within the footprint constraints of existing components, eliminating the need to redesign the product package. In COB manufacturing, an unpackaged silicon die is attached directly onto the surface of an FR4, flexible PCB or ceramic substrate and wire bonded to form the