资料介绍
多阶盲孔板制作技术分析
多阶盲孔板制作中的关键技术研究
摘 要：本文以四阶盲孔板制作过程为例，探讨了逐次层压法制作多阶盲孔板的一些关
键技术，包含盲孔的激光加工（RCC材料最小孔径为50μm，普通BT材料最小孔径为55μm）
，高厚径比盲孔的电镀（最大厚径比为1.4：1），多阶盲孔的对位（4阶盲孔）技术；这
些关键技术的解决将为实现多阶盲孔板的量产打下坚实的基础。
关键词：多阶盲孔 激光钻孔 高厚径比盲孔电镀 层间对位
Abstract: This paper main discusses key technology in multi-step
microvia’s manufacturing process, which is illustrated by a four-step
microvia board. These key points include laser drilling technology (the
minimum diameter reaches 55 microns), high ratio of board thickness to
microvia diameter’s plating technology (the maximum ratio reaches 1.4 to
1), and layer to layer registration technology. The solution to these key
control points will lay a solid foundation to realize multi-step microvia
board’s mass production.
Key words: multi-step microvia laser drilling plating registration
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