资料介绍
正确的布局和元件选择是控制EMI的关键MOSFET
EMI
LDO IC 300mV
LDO 1V 100mV
/ EMI/EMC
LDO LDO
/
3
/ / MAX1653 DC-DC 1 N1 N1 N2 2 N1 CIN IL-IINPUT CIN ESR COUT 10kHz
DC-DC 100kHz CIN
COUT CIN N1 N1 ESL 20MHz LX COUT 50MHz
CIN
I(INPUT) 660mA 0
INPUT 5V V+ VL
330mA I(CIN) 0 -660mA
BST MAX1653 DH LX SS N2 DL PGND REF GND CSH CSL D N1 L OUTPUT 3.3V
I(L) 1.0A 0 I(COUT) 0 5V V(LX) 0
1. N2
N1
2.
1
4
Q
LC
SEPIC SEPIC 5
3
SEPIC
INPUT
4
VL VCC
OUTPUT
EXT REF CS+ MAX668 PGND FREQ GND FB
4.
INPUT
INPUT
VL
VCC
OUTPUT EXT
VL
VCC
OUTPUT
EXT REF CS+ MAX668 PGND FREQ
REF
CS+ MAX668 PGND
FREQ GND FB
GND
FB
3.
5.
SEPIC
5
CP1
C P2A CP2B 7 CML1 CML2 SEPIC LDO IC LDO LDO PSRR
INPUT LX
6
300mV
POUT OUT TRACK
MAX1706 REF
FB
LDO
OUTPUT
7 MOSFET MOSFET
FBLDO PGND GND
TO-220 MOSFET
MOSFET
6.