工作2周年纪念, 回馈52RD-ADS高级应用AMC技术

A Faster and Effective RF ModuleLTCC Design Flow with AMC[5989-9475EN]Agilent EEsof EDA
A Faster and Effective RF Module/LTCC Design Flow with AMC

This document is owned by Agilent Technologies, but is no longer kept current and may contain obsolete or inaccurate references. We regret any inconvenience this may cause. For the latest information on Agilent’s line of EEsof electronic design automation (EDA) products and services, please go to:

www.agilent.com/nd/eesof

A Faster and Effective RF Module/LTCC Design Flow with AMC

HeeSoo LEE Agilent EEsof

Page 1

A Faster and Effective RF Module/LTCC Design Flow with AMC Version 1.0

Why Electro-Magnetic (EM) Simulation for RF Module/LTCC?
Majority of RF Module/LTCC components are embedded passives, integrated passives, packages, and 3D interconnects Circuit or analytical models for these components are limi