资料介绍
SOD323-2PDF: 2004 Jan 08
Philips Semiconductors
Package outline
Plastic surface mounted package; 2 leads
SOD323
D
A
E
X
HD
v
M
A
Q
1
2
bp A
A1
(1)
c Lp detail X
0
1 scale
2 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 1.1 0.8 A1 max 0.05 bp 0.40 0.25 c 0.25 0.10 D 1.8 1.6 E 1.35 1.15 HD 2.7 2.3 Lp 0.45 0.15 Q 0.25 0.15 v 0.2
Note 1. The marking bar indicates the cathode OUTLINE VERSION SOD323 REFERENCES IEC JEDEC JEITA SC-76 EUROPEAN PROJECTION ISSUE DATE 99-09-13 03-12-17
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