bypass capacitor

bypass capacitor1

Buried CapacitanceTM:

As electronic devices get faster, printed circuit boards need to be
designed with high speed operation in mind. Consideration must be given to
such design issues as power distribution, impedance, crosstalk and EMI,
load distribution and board structure (See also “Appnotes: Entering The
High-Speed Domain”). Buried CapacitanceTM can be utilized to improve power
distribution and reduce EMI emissions in high frequency digital
applications.

Capacitance Basics

A capacitor is formed when two conductive layers are separated by an
insulative (dielectric) material. By applying different voltages to the
conductive layers, energy is stored in the dielectric material which can be
released rapidly to system components. The amount of energy (capacitance)
is proportional to