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Bypass capicator in high speed

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Printed Circuit Board Design Techniques for EMC compliance1
Introduction

Printed Circuit Board Design Techniques for EMC Compliance is designed to help engineers minimize electromagnetic emissions generated by components (and circuits) to achieve acceptable levels of electromagnetic compatibility (EMC). It addresses both major aspects of EMC, which are 1. Emissions: Propagation of electromagnetic interference (EMI) from noncompliant devices (culprits), and in particular radiated and conducted radio frequency interference (RN) 2. Susceptibility: The detrimental effects on susceptible devices (victims) of EM1 in forms that include electrostatic discharge (ESD) and other forms of electrical overstress (EOS) The engineer’s goal is to meet design requirements to satisfy both international and domestic regulations and voluntary industry standards. The
Bypass capicator in high speed
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