资料介绍
手机中的3D封装堆叠技术2008
Invited Speaker
Catching the Mobile Wave: Packaging is Going 3D
2008 Burn-in and Test Socket Workshop March 9 - 12, 2008
Belgacem Haba, Ph.D.
Tessera
Outline
Introduction Driving forces and limitations 3-D package stacking 3-D wafer-level stacking 3-D by embedding technologies 3-D in optics Conclusion
Catching the Mobile Wave: Packaging is Going 3D 2
03/09/2008
March 9 - 12, 2008
1
2008
Invited Speaker
Packaging is the key
About 1cm cube of silicon The rest is Packaging
03/09/2008
Catching the Mobile Wave: Packaging is Going 3D
3
Mobile Phone Evolution
1970s
~$5000 Voice
03/09/2008
1980s
~$4000 Voice
1990s
~$300 Voice
Today
Free Voice, Data
4
Catching the Mobile Wave: Packaging is Going 3D
March 9 - 12, 2008
2
2008
Invited Speaker
Evolution of Memory
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